Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/18/2007
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Application #:
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11283974
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Filing Dt:
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11/22/2005
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Publication #:
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Pub Dt:
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05/24/2007
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Inventors:
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Richard Chen, Yen Lun Lee
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Title:
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MODULARIZED REDUNDANT HEAT SINK FOR DISSIPATING HEAT GENERATED FROM CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 980 ROCK AVENUE |
| SAN JOSE, CALIFORNIA 95131 |
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| DAVID E. DOUGHERTY |
| DENNISON, SCHULTZ, DOUGHERTY & MACDONALD |
| SUITE 105, 1727 KING STREET |
| ALEXANDRIA, VA 22314-2700 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 333 SOUTH HOPE STREET |
| 19TH FLOOR |
| LOS ANGELES, CALIFORNIA 90071 |
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| MCGUIREWOODS LLP |
| 1750 TYSONS BOULEVARD |
| SUITE 1800 |
| TYSONS, VA 22102 |
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