Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/25/2007
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Application #:
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11345104
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Filing Dt:
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01/31/2006
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Publication #:
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Pub Dt:
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06/15/2006
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Inventors:
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Koay Hean Tatt, Tan Gin Ghee
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Title:
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THERMALLY ENHANCED PACKAGE FOR AN INTEGRATED CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| AVAGO TECHNOLOGIES, LTD. |
| P.O. BOX 1920 |
| DENVER, CO 80201-1920 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE RD |
| SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| MEYERTONS, HOOD, KIVLIN, KOWERT & GOETZE |
| 1120 SOUTH CAPITAL OF TEXAS HIGHWAY |
| BUILDING 2, SUITE 300 |
| AUSTIN, TX 78746 |
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