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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/01/2008
Application #:
11139706
Filing Dt:
05/27/2005
Publication #:
Pub Dt:
11/30/2006
Inventor:
Richard A. Portune
Title:
METHOD FOR LOCAL WAFER THINNING AND REINFORCEMENT
Assignment: 1
Reel/Frame:
016628/0983Recorded: 05/27/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/26/2005
Assignee:
1421 CALIFORNIA CIRCLE, 95035
MILPITAS, CALIFORNIA 95035
Correspondent:
JOSEPH BACH
17460 LAKEVIEW DRIVE
MORGAN HILL, CA 95037
Assignment: 2
Reel/Frame:
022597/0728Recorded: 04/27/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/20/2008
Assignee:
45900 NORTHPORT LOOP EAST
FREMONT, CALIFORNIA 94538
Correspondent:
NIXON PEABODY LLP
401 NINTH STREET NW, SUITE 900
WASHINGTON, CA 20004

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