Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/01/2008
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Application #:
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11323300
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Filing Dt:
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12/30/2005
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Publication #:
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Pub Dt:
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07/05/2007
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Inventors:
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Saikumar Jayaraman, Stephen E. Lehman JR.
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Title:
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WAFER-LEVEL PROCESSING OF CHIP-PACKAGING COMPOSITIONS INCLUDING BIS-MALEIMIDES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| JOHN N. GREAVES |
| SCHWEGMAN, LUNDBERG & WOESSNER, P.A. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402-0938 |
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