Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/29/2008
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Application #:
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10529742
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Filing Dt:
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01/06/2006
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Publication #:
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Pub Dt:
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06/15/2006
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Inventors:
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Hiroshi Shiho, Yukio Hosaka, Kou Hasegawa, Nobuo Kawahashi
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Title:
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POLISHING PAD FOR SEMICONDUCTOR WAFER, POLISHING MULTILAYERED BODY FOR SEMICONDUCTOR WAFER HAVING SAME, AND METHOD FOR POLISHING SEMICONDUCTOR WAFER
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6-10, TSUKIJI 5-CHOME, CHUO-KU |
TOKYO 104-8410, JAPAN |
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OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST |
1940 DUKE STREET |
ALEXANDRIA, VA 22314 |
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