Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/05/2008
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Application #:
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11292769
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Filing Dt:
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12/02/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Inventors:
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Saravuth Sirinorakul, Arlene V. Layson, Somchai Nondhasitthichai, Yee Heong Chua
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING LEADFRAME ROUGHENED WITH CHEMICAL ETCHANT TO PREVENT SEPARATION BETWEEN LEADFRAME AND MOLDING COMPOUND
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE TO INCLUDE US PATENT NUMBER 7922877 IN THE COVER SHEET PREVIOUSLY RECORDED ON REEL 044403 FRAME 0596. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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