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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/12/2008
Application #:
10978566
Filing Dt:
11/02/2004
Publication #:
Pub Dt:
05/04/2006
Inventors:
Shih-Shian Ho, Hung-Yin Tsai, Chia-Jen Ting, Chun-Fa Lan, Chij-Chang Chen
Title:
METHOD FOR MANUFACTURING BONDED WAFER WITH ULTRA-THIN SINGLE CRYSTAL FERROELECTRIC FILM
Assignment: 1
Reel/Frame:
015958/0269Recorded: 11/02/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/13/2004
Exec Dt:
09/20/2004
Exec Dt:
10/13/2004
Exec Dt:
10/13/2004
Exec Dt:
10/14/2004
Assignee:
NO. 195, SEC. 4, CHUNG HSING RD.
CHUTUNG, HSINCHU, TAIWAN R.O.C.
Correspondent:
TROXELL LAW OFFICE PLLC
BRUCE H. TROXELL
5205 LEESBURG PIKE, SUITE 1404
FALLS CHURCH, VIRGINIA 22041-3401

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