Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/12/2008
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Application #:
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11148363
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Filing Dt:
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06/09/2005
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Publication #:
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Pub Dt:
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12/29/2005
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Inventors:
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Hideaki Saito, Muneo Fukaishi, Hiroaki Ikeda, Yasuhiko Hagihara, Masayuki Mizuno et al
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Title:
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THREE-DIMENSIONAL SEMICONDUCTOR DEVICE PROVIDED WITH INTERCHIP INTERCONNECTION SELECTION MEANS FOR ELECTRICALLY ISOLATING INTERCONNECTIONS OTHER THAN SELECTED INTERCHIP INTERCONNECTIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME |
| MINATO-KU, TOKYO 108-8001, JAPAN |
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| 2-1, YAESU 2-CHOME |
| CHUO-KU, TOKYO 104-0028, JAPAN |
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| MICHAEL J. SCHEER |
| DICKSTEIN SHAPIRO MORIN, ET AL. |
| 1177 AVENUE OF THE AMERICAS |
| 41ST FLOOR |
| NEW YORK, NY 10036-2714 |
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