Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/11/2008
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Application #:
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11079389
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Filing Dt:
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03/15/2005
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Publication #:
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Pub Dt:
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03/09/2006
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Inventors:
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Shih-Ping Hsu, Sao-Hsia Tang, Ying-Tung Wang, Wen-Hung Hu, Chao-Wen Shih, Meng-Da Chou
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Title:
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METHOD FOR FABRICATING CONDUCTIVE BUMP OF CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| SQUIRE SANDERS & DEMPSEY L.L.P. |
| 8000 TOWERS CRESCENT DRIVE |
| 14TH FLOOR |
| TYSONS CORNER, VIRGINIA 22182-2700 |
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