Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/08/2008
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Application #:
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10797003
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Filing Dt:
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03/11/2004
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Publication #:
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Pub Dt:
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09/16/2004
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Inventors:
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Akiji Shibata, Akihiro Okamoto, Yosuke Shimazaki, Kazumoto Komiya
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Title:
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MOLD DIE FOR A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OHTE-MACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8166 |
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| ANTONELLI, TERRY, STOUT ET.AL. |
| ALAN E. SCIAVELLI |
| 1300 NORTH SEVENTEENTH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-10-5, YOKOAMI, SUMIDA-KU |
| TOKYO, JAPAN 130-0015 |
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| ANTONELLI, TERRY, STOUT & KAUS, LLP |
| 1300 N. 17TH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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