Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/15/2008
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Application #:
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10757373
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Filing Dt:
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01/14/2004
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Publication #:
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Pub Dt:
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09/30/2004
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Inventor:
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Kazumi Hara
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Title:
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SEMICONDUCTOR CHIP, AND SEMICONDUCTOR WAFER INCLUDING A VARIABLE THICKNESS INSULATING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1 NISHI-SHINJUKU |
| 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| G. GREGORY SCHIVLEY |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN 3-DONG |
| YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-772 |
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| MICHELE P. MCMAHAN |
| 4140 PARKLAKE AVENUE |
| RALEIGH, NC 27612 |
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