Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/29/2008
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Application #:
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10500278
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Filing Dt:
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06/29/2004
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Publication #:
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Pub Dt:
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06/09/2005
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Inventors:
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Hiroyoshi Tominaga, Toshiyuki Hayashi
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Title:
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WAFER DOUBLE-SIDE POLISHING APPARATUS AND DOUBLE-SIDE POLISHING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| OLIFF & BERRIDGE, PLC |
| WILLIAM P. BERRIDGE |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| OLIFF & BERRIDGE, PLC |
| WILLIAM P. BERRIDGE |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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