Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/27/2008
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Application #:
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11447584
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Filing Dt:
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06/05/2006
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Publication #:
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Pub Dt:
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12/07/2006
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Inventor:
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Pao Hung Chou
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Title:
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METAL ELECTROPLATING PROCESS OF AN ELECTRICALLY CONNECTING PAD STRUCTURE OF CIRCUIT BOARD AND STRUCTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| NO. 10-1, JEN-YI ROAD |
| HSINCHU INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| SAWYER LAW GROUP LLP |
| P.O. BOX 51418 |
| PALO ALTO, CA 94303 |
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