Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/03/2008
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Application #:
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10542718
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Filing Dt:
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07/20/2005
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Publication #:
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Pub Dt:
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06/22/2006
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Inventor:
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Koji Nakayama
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Title:
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EPOXY GROUP-CONTAINING SILICON COMPOUND AND THERMOSETTING RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-2, FUJIMI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| NIELDS & LEMACK |
| 176 E. MAIN STREET |
| SUITE 7 |
| WESTBORO, MA 01581 |
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