Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/03/2008
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Application #:
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11277767
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Filing Dt:
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03/29/2006
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Publication #:
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Pub Dt:
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10/11/2007
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Inventor:
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Shih-Ping Hsu
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Title:
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SURFACE STRUCTURE OF FLIP CHIP SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSING RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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