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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/17/2008
Application #:
11470273
Filing Dt:
09/06/2006
Publication #:
Pub Dt:
12/27/2007
Inventors:
Yan-Kuin SU, Kuan-Chun CHEN, Chun-Liang LIN, Jin-Quan HUANG, Shu-Kai HU
Title:
METHOD FOR MANUFACTURING HEAT SINK OF SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
018206/0905Recorded: 09/06/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/18/2006
Exec Dt:
07/06/2006
Exec Dt:
07/07/2006
Exec Dt:
07/24/2006
Exec Dt:
07/06/2006
Assignee:
NO. 1, TA-HSUEH ROAD
TAINAN CITY, TAIWAN
Correspondent:
LOWE HAUPTMAN & BERNER, LLP
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA, VA 22314

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