Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/17/2008
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Application #:
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11449107
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Filing Dt:
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06/08/2006
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Publication #:
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Pub Dt:
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12/14/2006
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Inventors:
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Kazuhiro Urashima, Tatsuharu Ikawa, Mitsuo Shiraishi, Hiroshi Sumi
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Title:
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WIRING SUBSTRATE AND BONDING PAD COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-18 TAKATSUJI-CHO |
| MIZUHO-KU, NAGOYA, JAPAN 467-8525 |
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| MARK KUSNER, KUSNER & JAFFE |
| HIGHLAND PLACE - SUITE 310 |
| 6151 WILSON MILLS ROAD |
| HIGHLAND HEIGHTS, OHIO 44143 |
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