Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/24/2008
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Application #:
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11059732
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Filing Dt:
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02/17/2005
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Publication #:
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Pub Dt:
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08/04/2005
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Inventors:
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Ken Chen, Chender Huang, Pei-Haw Tsao, Jones Wang, Hank Huang
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Title:
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ENHANCED ADHESION STRENGTH BETWEEN MOLD RESIN AND POLYIMIDE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77, R.O.C. |
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| DANIEL R. MCCLURE |
| THOMAS, KAYDEN, HORSTEMEYER, ET AL |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GEORGIA 30339-5948 |
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