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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/01/2008
Application #:
10772242
Filing Dt:
02/06/2004
Publication #:
Pub Dt:
08/12/2004
Inventor:
Chang-Ho Cho
Title:
MOLD DIE FOR MOLDING CHIP ARRAY, MOLDING EQUIPMENT INCLUDING THE SAME, AND METHOD FOR MOLDING CHIP ARRAY
Assignment: 1
Reel/Frame:
014974/0620Recorded: 02/06/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/26/2003
Assignee:
416 MAETAN-DONG, YEONGTONG-GU SUWON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
HARNESS, DICKEY & PIERCE , P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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