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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
7405158
Issue Dt:
07/29/2008
Application #:
11038592
Filing Dt:
01/19/2005
Publication #:
20060009034
Pub Dt:
01/12/2006
Inventors:
Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Joseph Castro, Hongbin Fang et al
Title:
METHODS FOR DEPOSITING TUNGSTEN LAYERS EMPLOYING ATOMIC LAYER DEPOSITION TECHNIQUES
Assignment: 1
Reel/Frame:
016828/0522Recorded: 09/20/2005Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LAI, KEN KAUNG
Exec Dt:
06/28/2005
RAJAGOPALAN, RAVI
Exec Dt:
06/24/2005
KHANDELWAL, AMIT
Exec Dt:
06/15/2005
MOORTHY, MADHU
Exec Dt:
06/09/2005
GANDIKOTA, SRINIVAS
Exec Dt:
06/09/2005
CASTRO, JOSEPH
Exec Dt:
06/10/2005
GELATOS, AVERGINOS V.
Exec Dt:
06/17/2005
KNEPFLER, CHERYL
Exec Dt:
06/17/2005
JIAN, PING
Exec Dt:
07/25/2005
FANG, HONGBIN
Exec Dt:
06/22/2005
HUANG, CHAO-MING
Exec Dt:
09/05/2005
XI, MING
Exec Dt:
07/05/2005
YANG, MICHAEL X.
Exec Dt:
06/27/2005
CHUNG, HUA
Exec Dt:
06/19/2005
BYUN, JEONG SOO
Exec Dt:
07/28/2005
Assignee:
APPLIED MATERIALS, INC.
P.O. BOX 450-A
PATENT COUNSEL
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS INC
PATENT COUNSEL
P.O. BOX 450-A
SANTA CLARA, CA 95052

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