Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/02/2008
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Application #:
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11560787
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Filing Dt:
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11/16/2006
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Publication #:
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Pub Dt:
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11/22/2007
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Inventors:
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WEN-CHIN LEE, CHENG-HSIEN LIN
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Title:
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METHOD FOR FORMING STACKED VIA-HOLES IN A MULTILAYER PRINTED CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE |
| TAYUAN, TAOYUAN, TAIWAN |
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| JEFFREY KNAPP |
| 458 E. LAMBERT ROAD |
| FULLERTON, CA 92835 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE |
| TAYUAN, TAOYUAN, TAIWAN |
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| RAYMOND J. CHEW |
| 288 SOUTH MAYO AVENUE |
| CITY OF INDUSTRY, CA 91789 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F., NO.156,SEC 1,ZHONGSHAN RD.,BANQIAO DIST.,,NEW TAIPEI CITY 22065,TAIWAN(R.O.C) |
| NEW TAIPEI, TAIWAN |
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| ZHIGANG MA |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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