Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/23/2008
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Application #:
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10719218
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Filing Dt:
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11/20/2003
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Inventors:
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Wen-Chou Vincent Wang, Yuan Li
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Title:
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STRUCTURE, MATERIAL, AND DESIGN FOR ASSEMBLING A LOW-K SI DIE TO ACHIEVE AN INDUSTRIAL GRADE RELIABILITY WIRE BONDING PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 INNOVATION DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| BEYER WEAVER & THOMAS LLP |
| P.O. BOX 778 |
| BERKELEY, CA 94704-0778 |
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