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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/07/2008
Application #:
11636342
Filing Dt:
12/08/2006
Publication #:
Pub Dt:
06/14/2007
Inventors:
Yukihiro Fukatsu, Toshikazu Sakurai, Youjirou Hashimoto, Yasushi Okayasu et al
Title:
CONNECTOR ASSEMBLY WITH MOLD REMOVAL HOLE
Assignment: 1
Reel/Frame:
018798/0350Recorded: 01/24/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/25/2006
Exec Dt:
12/27/2006
Exec Dt:
12/22/2006
Exec Dt:
12/22/2006
Exec Dt:
12/22/2006
Assignee:
1-14, NISHISUEHIRO-CHO
YOKKAICHI-CITY, JAPAN 510-8503
Correspondent:
GERALD E. HESPOS
274 MADISON AVENUE - SUITE 1703
NEW YORK, NY 10016

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