Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/21/2008
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Application #:
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12044692
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Filing Dt:
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03/07/2008
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Inventors:
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Timothy Harrison Daubenspeck, Wolfgang Sauter, Jeffrey P. Gambino, David L. Questad
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Title:
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DESIGN STRUCTURE FOR FINAL VIA DESIGNS FOR CHIP STRESS REDUCTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| THE LAW FIRM OF ANDREA HENCE EVANS, LLC |
| 14625 BALTIMORE AVE., #853 |
| LAUREL, MD 20707 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 121, PARK AVE.3, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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