Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/04/2008
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Application #:
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11530096
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Filing Dt:
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09/08/2006
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Publication #:
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Pub Dt:
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03/13/2008
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Inventors:
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Kuo-Len Lin, Tien-Chih Tseng, Ming-Chang Liu, Wen-Jung Liu
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Title:
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THERMAL INTERFACE MATERIAL COMPOUND AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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