Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/04/2008
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Application #:
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10911088
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Filing Dt:
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08/04/2004
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Inventor:
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Yuan Li
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Title:
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PAD STRUCTURES TO IMPROVE BOARD-LEVEL RELIABILITY OF SOLDER-ON-PAD BGA STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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101 INNOVATION DRIVE |
SAN JOSE, CALIFORNIA 95134 |
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MORGAN, LEWIS & BOCKIUS LLP |
FRANCIS E. MORRIS |
3000 EL CAMINO REAL, SUITE 900 |
2 PALO ALTO SQUARE |
PALO ALTO, CA 94306 |
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