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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/11/2008
Application #:
10519713
Filing Dt:
12/30/2004
Publication #:
Pub Dt:
03/02/2006
Inventors:
Hidekazu Matsuura, Toshiyasu Kawai
Title:
ADHESIVE FILM FOR SEMICONDUCTOR, METAL SHEET WITH SUCH ADHESIVE FILM, WIRING SUBSTRATE WITH ADHESIVE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTRING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
016919/0734Recorded: 12/30/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/14/2004
Exec Dt:
10/14/2004
Assignee:
1-1, NISHISHINJUKU 2-CHOME
SHINJUKI-KU, TOKYO 163-0449, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH 17TH STREET - SUITE 1800
ARLINGTON, VA 22209

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