Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/18/2008
|
Application #:
|
11501913
|
Filing Dt:
|
08/10/2006
|
|
Publication #:
|
|
Pub Dt:
|
02/15/2007
| | | | |
|
Inventors:
|
Kai Chong Chan, Charles Wee Ming Lee, Gerald Ofner
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH CONTACT SUPPORT LAYER AND METHOD TO PRODUCE THE PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| ST.-MARTIN-STR. 53 |
| MUNICH, GERMANY 81669 |
|
|
|
|
| PATRICK FINNAN (EDELL, SHAPIRO & FINNAN) |
| 1901 RESEARCH BLVD. |
| SUITE 400 |
| ROCKVILLE, MD 20850 |
|
|
Search Results as of:
05/10/2024 03:45 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
