Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/18/2008
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Application #:
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10765931
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Filing Dt:
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01/29/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Inventors:
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Youichi Kukimoto, Hitoshi Sakurai, Seishi Kumamoto, Kenshu Oyama
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Title:
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SOLDER DEPOSITION METHOD AND SOLDER BUMP FORMING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 671-4, MIZUASHI, NOGUCHI-CHO, KAKOGAWA-SHI |
| HYOGO 675-0019, JAPAN |
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| SUGHRUE MION, PLLC |
| GORDON KIT |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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