Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/18/2008
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Application #:
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11613247
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Filing Dt:
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12/20/2006
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Publication #:
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Pub Dt:
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06/26/2008
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Inventors:
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Wen-Kun Yang, Chun-Hui Yu, Chao-Nan Chou, Chih-Wei Lin, Ching-Shun Huang
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Title:
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STRUCTURE OF DIELECTRIC LAYERS IN BUILT-UP LAYERS OF WAFER LEVEL PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 65, GUANGFU N. RD. |
| HUKOU TOWNSHIP |
| HSINCHU COUNTY, TAIWAN 303 |
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| MICHAEL A. JAFFE |
| 6151 WILSON MILLS ROAD |
| HIGHLAND PLACE - SUITE 310 |
| HIGHLAND HEIGHTS, OH 44143 |
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