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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7453149
Issue Dt:
11/18/2008
Application #:
11024916
Filing Dt:
12/28/2004
Publication #:
20060027925
Pub Dt:
02/09/2006
Inventors:
Cheng-Lin Huang, Ching-Hua Hsieh, Hsien-Ming Lee, Shing-Chyang Pan, Chao-Hsien Peng et al
Title:
COMPOSITE BARRIER LAYER
Assignment: 1
Reel/Frame:
016139/0569Recorded: 12/28/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUANG, CHENG-LIN
Exec Dt:
11/25/2004
HSIEH, CHING-HUA
Exec Dt:
12/25/2004
LEE, HSIEN-MING
Exec Dt:
11/25/2004
PAN, SHING-CHYANG
Exec Dt:
11/25/2004
PENG, CHAO-HSIEN
Exec Dt:
11/25/2004
SU, LI-LIN
Exec Dt:
11/25/2004
LIN, JING-CHENG
Exec Dt:
11/25/2004
SHUE, SHAU-LIN
Exec Dt:
11/25/2004
LIANG, MONG-SONG
Exec Dt:
11/25/2004
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6
SCIENCE BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77 R.O.C.
Correspondent:
WILLIAM H. MURRAY, ESQUIRE
DUANE MORRIS LLP
ONE LIBERTY PLACE
PHILADELPHIA, PA 19103
Assignment: 2
Reel/Frame:
016575/0671Recorded: 07/26/2005Pages: 5
Conveyance:
CORRECTED COVER SHEET TO CORRECT ASSIGNOR'S NAME, PEVIOUSLY RECORDED AT REEL/FRAME 016139/0569 (ASSIGNMENT OF ASSIGNOR'S INTEREST)
Assignors:
HUANG, CHENG-LIN
Exec Dt:
11/25/2004
HSIEH, CHING-HUA
Exec Dt:
11/25/2004
LEE, HSIEN-MING
Exec Dt:
11/25/2004
PAN, SHING-CHYANG
Exec Dt:
11/25/2004
PENG, CHAO-HSIEN
Exec Dt:
11/25/2004
SU, LI-LIN
Exec Dt:
11/25/2004
LIN, JING-CHENG
Exec Dt:
11/25/2004
SHUE, SHAU-LIN
Exec Dt:
11/25/2004
LIANG, MONG-SONG
Exec Dt:
11/25/2004
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6
SCIENCE BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77 R.O.C.
Correspondent:
WILLIAM H. MURRAY, ESQIRE
DUANE MORRIS LLP
ONE LIBERTY PLACE
PHILADELPHIA, PA 19103

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