Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/09/2008
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Application #:
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11293711
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Filing Dt:
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12/01/2005
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Publication #:
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Pub Dt:
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06/07/2007
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Inventors:
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Ran Fu, Deming Liu, Yiu Fai Kwan
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Title:
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LEADFRAME COMPRISING TIN PLATING OR AN INTERMETALLIC LAYER FORMED THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20/F., WATSON CENTRE, 16-22 KUNG YIP ST |
| KWAI CHUNG, HONG KONG, CHINA SAR |
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| OSTROLENK, FABER, GERB & SOFFEN, LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036-8403 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UNIT B1, PORTION B, 1/F, GATEWAY TS, 8 CHEUNG FAI ROAD |
| TSING YI, NT, HONG KONG |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JEI IBL JERSEY |
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