Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/06/2009
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Application #:
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12107316
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Filing Dt:
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04/22/2008
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Inventors:
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David Danovitch, Julien Sylvestre
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Title:
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TEMPORARY STRUCTURE TO REDUCE STRESS AND WARPAGE IN A FLIP CHIP ORGANIC PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| OPPENHEIMER WOLFF & DONNELLY LLP |
| 45 SOUTH SEVENTH STREET |
| PLAZA VII, SUITE 3300 |
| MINNEAPOLIS, MN 55402-1609 |
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