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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/20/2009
Application #:
11333346
Filing Dt:
01/18/2006
Publication #:
Pub Dt:
06/01/2006
Inventors:
Rouh Huey Uang, Yu-Chih Chen
Title:
COMPOSITE CONDUCTIVE FILM AND SEMICONDUCTOR PACKAGE USING SUCH FILM
Assignment: 1
Reel/Frame:
017515/0023Recorded: 01/18/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/21/2005
Exec Dt:
12/21/2005
Assignee:
NO. 195, SEC. 4, CHUNG-HSING RD.
CHU-TUNG, HSINCHU, TAIWAN R.O.C.
Correspondent:
HARNESS DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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