Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/10/2009
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Application #:
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11309852
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Filing Dt:
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10/13/2006
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Publication #:
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Pub Dt:
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11/22/2007
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Inventors:
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Wen-Chin Lee, Cheng-Hsien Lin
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Title:
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METHOD FOR FORMING STACKED VIA-HOLES IN PRINTED CIRCUIT BOARDS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE |
TAYUAN, TAOYUAN, TAIWAN |
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PCE INDUSTRY, INC. |
ATT. CHENG-JU CHIANG JEFFREY T. KNAPP |
458 E. LAMBERT ROAD |
FULLERTON, CA 92835 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE |
TAYUAN, TAOYUAN, TAIWAN |
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RAYMOND J. CHEW |
288 SOUTH MAYO AVENUE |
CITY OF INDUSTRY, CA 91789 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4F., NO.156,SEC 1,ZHONGSHAN RD.,BANQIAO DIST.,,NEW TAIPEI CITY 22065,TAIWAN(R.O.C) |
NEW TAIPEI, TAIWAN |
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ZHIGANG MA |
550 S. HOPE STREET, SUITE 2825 |
LOS ANGELES, CA 90071 |
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