Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/10/2009
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Application #:
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11530952
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Filing Dt:
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09/12/2006
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Publication #:
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Pub Dt:
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03/13/2008
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Inventors:
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Wan Jae Park, Jae Hak Kim, Tong Qing Chen, Yi-hsiung Lin
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Title:
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METHODS OF FORMING ELECTRICAL INTERCONNECT STRUCTURES USING POLYMER RESIDUES TO INCREASE ETCHING SELECTIVITY THROUGH DIELECTRIC LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MYERS BIGEL SIBLEY & SAJOVEC PA |
| 4140 PARKLAKE AVENUE |
| SUITE 600 |
| RALEIGH, NC 27612 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D |
| STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| MBSS/CANDI L. RIGGS |
| 4140 PARKLAKE AVENUE |
| SUITE 600 |
| RALEIGH, NC 27612 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| MBSS/CANDI L. RIGGS |
| 4140 PARKLAKE AVENUE |
| SUITE 600 |
| RALEIGH, NC 27612 |
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