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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/24/2009
Application #:
10869814
Filing Dt:
06/16/2004
Publication #:
Pub Dt:
12/22/2005
Inventors:
David M. Isaacson, Eugene A. Fitzgerald
Title:
STRAINED SILICON-ON-SILICON BY WAFER BONDING AND LAYER TRANSFER
Assignment: 1
Reel/Frame:
016007/0170Recorded: 11/22/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/15/2004
Exec Dt:
11/01/2004
Assignee:
KENDALL SQUARE, 5 CAMBRIDGE CENTER
ROOM NE25-230
CAMBRIDGE, MASSACHUSETTS 02142-1493
Correspondent:
JAMIE H. ROSE
WOLF, GREENFIELD & SACKS, P.C.
600 ATLANTIC AVENUE
BOSTON, MA 02210-2206
Assignment: 2
Reel/Frame:
015952/0009Recorded: 11/04/2004Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/01/2004
Exec Dt:
06/15/2004
Exec Dt:
06/15/2004
Assignee:
5 CAMBRIDGE CENTER, KENDALL SQUARE
ROOM NE25-230
CAMBRIDGE, MASSACHUSETTS 02142-1493
Correspondent:
JAMIS H. ROSE
WOLF, GREENFIELD & SACKS, P.C.
600 ATLANTIC AVENUE
BOSTON, MA 02210-2206

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