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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/03/2009
Application #:
11742120
Filing Dt:
04/30/2007
Publication #:
Pub Dt:
10/30/2008
Inventors:
Sylvie S. Charles, David D. Danovitch, Sylvain S.E. Ouimet, Julien J. Sylvestre
Title:
STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRONIC PACKAGES USING UNDERFILL MATERIALS WITH SPATIALLY VARYING PROPERTIES
Assignment: 1
Reel/Frame:
019228/0422Recorded: 04/30/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/30/2007
Exec Dt:
04/27/2007
Exec Dt:
04/27/2007
Exec Dt:
04/27/2007
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
CANTOR COLBURN LLP
55 GRIFFIN ROAD SOUTH
BLOOMFIELD, CT 06002
Assignment: 2
Reel/Frame:
028867/0216Recorded: 08/29/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/18/2012
Assignee:
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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