Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/03/2009
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Application #:
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10965868
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Filing Dt:
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10/18/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Inventors:
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Tetsuya Osaka, Tokihiko Yokoshima, Isao Sato, Akira Hashimoto, Yoshio Hagiwara
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Title:
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SEMICONDUCTOR MULTILAYER WIRING BOARD AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 104, TOTSUKA-MACHI 1-CHOME |
| SHINJYUKU-KU, TOKYO 169-8050, JAPAN |
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| 150 NAKAMARUKO, NAKAHARA-KU |
| KAWASAKI-SHI |
| KANAGAWA PREFECURE 211-0012, JAPAN |
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| WENDEROTH LIND & PONACK, L.L.P. |
| ATTN: JEFFREY R. FILIPEK, ESQ. |
| 2033 K STREET, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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