Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/10/2009
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Application #:
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11188322
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Filing Dt:
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07/25/2005
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Publication #:
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Pub Dt:
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02/02/2006
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Inventors:
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Tetsuya Koyama, Tsuyoshi Kobayashi
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Title:
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SEMICONDUCTOR CHIP-EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI |
| NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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| JOHN F. MCNULTY |
| PAUL & PAUL |
| 2900 TWO THOUSAND MARKET STREET |
| PHILADELPHIA, PA 19103 |
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