Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/17/2009
|
Application #:
|
11509567
|
Filing Dt:
|
08/25/2006
|
|
Publication #:
|
|
Pub Dt:
|
03/08/2007
| | | | |
|
Inventors:
|
Eiichiro Matsubara, Tetsu Ichitsubo, Takaaki Anada, Seishi Kumamoto, Hisao Irie
|
|
Title:
|
METHOD OF MANUFACTURING THE SNZNNICU SOLDER POWDER AND THE SNZNNICU SOLDER POWDER
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 671-4, MIZUASHI, NOGUCHI-CHO |
| KAKOGAWA-SHI, HYOGO, JAPAN 675-0019 |
|
|
|
|
| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
|
|
Search Results as of:
05/03/2024 05:47 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
