Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/31/2009
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Application #:
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11165465
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Filing Dt:
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06/22/2005
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Publication #:
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Pub Dt:
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12/28/2006
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Inventors:
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John Heck, Qing Ma, Quan Tran, Tsung-Kuan Allen Chou, Semeon Altshuler, Boaz Weinfeld
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Title:
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THROUGH-WAFER VIAS AND SURFACE METALLIZATION FOR COUPLING THERETO
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
CORY G. CLAASSEN |
124 WILSHIRE BOULEVARD, 7TH FLOOR |
LOS ANGELES, CA 90025 |
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