Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/31/2009
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Application #:
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11420241
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Filing Dt:
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05/25/2006
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Publication #:
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Pub Dt:
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11/29/2007
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Inventors:
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Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth JR., Robert E. Simons et al
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Title:
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METHODS FOR FABRICATING A COOLED ELECTRONIC MODULE EMPLOYING A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD, |
ARMONK, NEW YORK 10504 |
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LILY NEFF |
IBM CORPORATION - P386 |
INTELLECTUAL PROPERTY LAW |
2455 SOUTH ROAD |
POUGHKEEPSIE, NY 12601 |
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