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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/21/2009
Application #:
10526008
Filing Dt:
02/25/2005
Publication #:
Pub Dt:
01/26/2006
Inventors:
Mitsuo Ishikawara, Kouji Taya, Rikiya Kobayashi, Hideki Ebihara, Tateo Yamada
Title:
SEMICONDUCTOR- SEALING -PURPOSE EPOXY RESIN COMPOUND PRODUCING METHOD
Assignment: 1
Reel/Frame:
017498/0218Recorded: 01/25/2006Pages: 3
Conveyance:
THERE WAS AN ERROR IN THE ASSIGNEE'S NAME ON BOTH THE PREVIOUS COVER SHEET AND NOTICE OF RECORDATION DUE TO ERROR ON THE PART OF THE APPLICANT
Assignors:
Exec Dt:
12/20/2004
Exec Dt:
12/20/2004
Exec Dt:
12/20/2004
Exec Dt:
12/20/2004
Exec Dt:
12/20/2004
Assignee:
1-1, NISHINSHINJUKU 2-CHOME
SHINJUKU-KU, TOKYO 163-0449, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH 17TH STREET - SUITE 1800
ARLINGTON, VA 22209

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