Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/21/2009
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Application #:
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10552540
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Filing Dt:
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10/11/2005
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Publication #:
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Pub Dt:
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09/14/2006
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Inventors:
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Shigeru Tanaka, Kanji SHimoohsako, Takashi Itoh, Koji Okada, Mutsuaki Murakami
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Title:
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THERMOSETTING RESIN COMPOSITION, MULTILAYER BODY USING SAME, AND CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4, NAKANOSHIMA 3-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA 530-8288, JAPAN |
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| HOGAN & HARTSON L.L.P. |
| DARIUSH G. ADLI, ESQ. |
| 500 SOUTH GRAND AVENUE, SUITE 1900 |
| LOS ANGELES, CA 90071 |
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Assignment:
2
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| 2-3-18, NAKANOSHIMA, KITA-KU |
| OSAKA, JAPAN |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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