Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/21/2009
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Application #:
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11950714
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Filing Dt:
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12/05/2007
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Publication #:
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Pub Dt:
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06/12/2008
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Inventor:
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Kung-Jen Yan
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Title:
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CLIP MODULE AND HEAT-DISSIPATION DEVICE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F., NO. 37, SEC. 2, JHONGYANG S. RD. |
| PEITOU DISTRICT |
| TAIPEI 112, TAIWAN R.O.C. |
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| J. C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F., NO.76, LIGONG ST., BEITOU DISTRICT, |
| TAIPEI CITY, TAIWAN 112 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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