Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/28/2009
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Application #:
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10532717
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Filing Dt:
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09/29/2005
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Publication #:
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Pub Dt:
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03/16/2006
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Inventors:
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Toshiko Yokota, Tetsuhiro Matsunaga, Susumu Takahashi, Hideaki Matsushima et al
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Title:
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COPPER FOIL PROVIDED WITH DIELECTRIC LAYER FOR FORMING CAPACITOR LAYER, COPPER CLAD LAMINATE FOR FORMATION OF CAPACITOR LAYER USING SUCH COPPER FOIL WITH DIELECTRIC LAYER, AND METHOD FOR MANUFACTURING PRODUCING SUCH COPPER FOIL WITH DIELECTRIC LAYER FOR FORMATION OF CAPACITOR LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO 141-8584, JAPAN |
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| ROBERT B. MURRAY |
| ROTHWELL, FIGG, ERNST & MANBECK |
| SUITE 800 |
| 1425 K ST., N.W. |
| WASHINGTON, D.C. 20005 |
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