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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7524750
Issue Dt:
04/28/2009
Application #:
11553772
Filing Dt:
10/27/2006
Publication #:
20070243693
Pub Dt:
10/18/2007
Inventors:
Srinivas D. Nemani, Young S. Lee, Ellie Y. Yieh, Anchuan Wang, Jason Thomas Bloking et al
Title:
INTEGRATED PROCESS MODULATION (IPM) A NOVEL SOLUTION FOR GAPFILL WITH HDP-CVD
Assignment: 1
Reel/Frame:
018447/0714Recorded: 10/27/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NEMANI, SRINIVAS D.
Exec Dt:
10/20/2006
LEE, YOUNG S.
Exec Dt:
10/23/2006
YIEH, ELLIE Y.
Exec Dt:
10/23/2006
WANG, ANCHUAN
Exec Dt:
10/23/2006
BLOKING, JASON THOMAS
Exec Dt:
10/23/2006
Assignee:
APPLIED MATERIALS, INC.
P.O. BOX 450A
LEGAL AFFAIRS DEPT.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
ROBERT W. MULCAHY
P.O. BOX 450A
LEGAL AFFAIRS DEPT.
SANTA CLARA, CA 95052
Assignment: 2
Reel/Frame:
018762/0026Recorded: 01/16/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HAN, LUNG-TIEN
Exec Dt:
12/07/2006
Assignee:
APPLIED MATERIALS, INC.
P. O. BOX 450A
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS
P.O. BOX 450A
SANTA CLARA, CA 95052

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