Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/05/2009
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Application #:
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11370018
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Filing Dt:
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03/06/2006
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Publication #:
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Pub Dt:
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10/19/2006
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Inventor:
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Eiichi Sato
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Title:
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DEVICE PACKAGE STRUCTURE, DEVICE PACKAGING METHOD, LIQUID DROP EJECTION METHOD, CONNECTOR, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 163-0811 |
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| G. GREGORY SCHIVLEY |
| HARNESS DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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