Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/05/2009
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Application #:
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11000516
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Filing Dt:
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11/30/2004
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Publication #:
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Pub Dt:
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06/16/2005
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Inventor:
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Hideo Imai
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Title:
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SEMICONDUCTOR DEVICE HAVING INSULATING MATERIAL DISPERSED WITH CONDUCTIVE PARTICLES WHICH ESTABLISH ELECTRICAL CONNECTION BY PENETRATING TO BOTH COPPER CONDUCTIVE LAYER AND LAND OF WIRING BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1 NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU TOKYO, JAPAN 163-0811 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| G. GREGORY SCHIVLEY |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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